[ME2026] Advancing Component Reliability: YUJIN PREFORM Showcases Customized Solder Preform Solutions for Precision Joining The BITEC Exhibition Centre in Bangkok, Thailand, hosted the comprehensive manufacturing technology trade show, Manufacturing Expo 2026 (ME2026), from June 17 to 20. Organized by RX BITEC, the four-day event co-located seven specialized industrial exhibitions: InterPlas, InterMold, Automotive Manufacturing, Surface & Coatings, NEPCON, ASSEMBLY & AUTOMATION, and FACTECH. In the ASSEMBLY & AUTOMATION 2026 section, which addresses factory automation and assembly technologies, South Korean material and component specialist YUJIN PREFORM introduced an extensive lineup of customized solder preforms engineered to enhance structural reliability in electronic substrates and semiconductor packaging.Mitigating Physical Constraints in SMT Processes Through Volumetric ControlAt the exhibition venue, Go I-jin, Manager at YUJIN PREFORM, discussed the technical requirements for preventing common joining defects encountered during Surface Mount Technology (SMT) and material processing. Pre-shaped solder components serve as a critical technical remedy when insufficient solder volume prevents adequate fillet formation on specific components, or when variance in solder volume causes tombstoning defects that misalign materials during reflow.Compared to traditional solder paste, solder preforms offer precise volumetric control, helping to reduce the formation of internal voids during semiconductor assembly and component placement. Manufactured in predefined geometric configurations—such as discs, rectangles, and rings—these preforms are positioned between components or directly onto PCB pads to form stable mechanical and electrical connections upon melting. Solder preforms can be applied in high volumes within automated lines requiring complex soldering configurations, stated Manager Go. By replacing conventional wave soldering, robotic soldering, or manual soldering methods, they serve as an effective driver for managing both equipment expenditures and labor costs on the factory floor.Process-Specific Configurations and Structural DiversificationYUJIN PREFORM has diversified its portfolio of standard and customized non-standard preforms by leveraging alloy formulation technologies, including lead-free, leaded, and specialized custom compositions. Chip solders fabricated to match standard SMT component dimensions and customized pattern preforms complement the structural constraints of stencil mask deposition, allowing for stable thermal joining over broader surface areas. Furthermore, array preforms designed to replicate connector layouts enable the simultaneous joining of multi-terminal headers, while flux-coated preforms minimize gas entrapment by controlling external flux ratios to manage internal void density. For thermal dissipation requirements, metal and special preforms fabricated from copper or aluminum are placed within power semiconductors, RF amplifiers, and automotive electronic heat sinks to establish thermal escape paths. These components are supplied in Tape & Reel (T&R) packaging to integrate directly into automated feeder lines, simplifying complex assembly steps.We have accumulated customized solutions over many years, allowing us to align custom alloy formulations and complex non-standard geometries with diverse manufacturing environments, added Manager Go. This depth of expertise allows us to reduce operational variables and defect rates in real-world applications.Functional Characteristics of Low-Temperature Flux-Coated Washers for Heat-Sensitive ComponentsTo protect electronic materials prone to thermal degradation or distortion under high-temperature exposure—such as sensors, LEDs, and batteries—YUJIN PREFORM highlighted its low-temperature solder flux-coated washers fabricated from bismuth-based alloys that melt at 138°C.This component features an integrated layer of flux controlled to exact volumetric proportions directly on the washer surface, eliminating the need for separate flux deposition steps. This layout enables an integrated assembly sequence that combines mechanical fastening with thermal application. By preventing both insufficient and excessive solder distribution, the washers maintain uniformity across the joining interface. Because the alloy automatically liquefies and joins upon reaching its specified melting point, it functions as a mechanism for stabilizing machine uptime in manual-intensive or temperature-restricted sectors, including automotive electronics and aerospace manufacturing. To complement joint reliability, YUJIN PREFORM has also strengthened its deburring processes to remove micro-burrs formed during production.Since its establishment in 2005, YUJIN PREFORM has expanded its material expertise, focusing on structural transparency in pricing and delivery flexibility for the Southeast Asian automotive value chain and electronics supply networks at this Thailand exhibition. As manufacturing hubs continue to diversify across the region, the company provides actionable yield-stabilization benchmarks for ASEAN enterprises seeking high-quality precision component fabrication.

[ME2026] Advancing Component Reliability: YUJIN PREFORM Showcases Customized Solder Preform Solutions for Precision Joining

기사입력 2026-06-24 11:49:33

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[산업일보]
The BITEC Exhibition Centre in Bangkok, Thailand, hosted the comprehensive manufacturing technology trade show, Manufacturing Expo 2026 (ME2026), from June 17 to 20. Organized by RX BITEC, the four-day event co-located seven specialized industrial exhibitions: InterPlas, InterMold, Automotive Manufacturing, Surface & Coatings, NEPCON, ASSEMBLY & AUTOMATION, and FACTECH. In the "ASSEMBLY & AUTOMATION 2026" section, which addresses factory automation and assembly technologies, South Korean material and component specialist YUJIN PREFORM introduced an extensive lineup of customized solder preforms engineered to enhance structural reliability in electronic substrates and semiconductor packaging.

유진프리폼 고이진 부장(좌측)이 부스에서 설명하고 있다

Mitigating Physical Constraints in SMT Processes Through Volumetric Control
At the exhibition venue, Go I-jin, Manager at YUJIN PREFORM, discussed the technical requirements for preventing common joining defects encountered during Surface Mount Technology (SMT) and material processing. Pre-shaped solder components serve as a critical technical remedy when insufficient solder volume prevents adequate fillet formation on specific components, or when variance in solder volume causes tombstoning defects that misalign materials during reflow.

Compared to traditional solder paste, solder preforms offer precise volumetric control, helping to reduce the formation of internal voids during semiconductor assembly and component placement. Manufactured in predefined geometric configurations—such as discs, rectangles, and rings—these preforms are positioned between components or directly onto PCB pads to form stable mechanical and electrical connections upon melting. "Solder preforms can be applied in high volumes within automated lines requiring complex soldering configurations," stated Manager Go. "By replacing conventional wave soldering, robotic soldering, or manual soldering methods, they serve as an effective driver for managing both equipment expenditures and labor costs on the factory floor."

Process-Specific Configurations and Structural Diversification
YUJIN PREFORM has diversified its portfolio of standard and customized non-standard preforms by leveraging alloy formulation technologies, including lead-free, leaded, and specialized custom compositions. Chip solders fabricated to match standard SMT component dimensions and customized pattern preforms complement the structural constraints of stencil mask deposition, allowing for stable thermal joining over broader surface areas.

Furthermore, array preforms designed to replicate connector layouts enable the simultaneous joining of multi-terminal headers, while flux-coated preforms minimize gas entrapment by controlling external flux ratios to manage internal void density. For thermal dissipation requirements, metal and special preforms fabricated from copper or aluminum are placed within power semiconductors, RF amplifiers, and automotive electronic heat sinks to establish thermal escape paths. These components are supplied in Tape & Reel (T&R) packaging to integrate directly into automated feeder lines, simplifying complex assembly steps.

"We have accumulated customized solutions over many years, allowing us to align custom alloy formulations and complex non-standard geometries with diverse manufacturing environments," added Manager Go. "This depth of expertise allows us to reduce operational variables and defect rates in real-world applications."

유진프리폼 진열 제품

Functional Characteristics of Low-Temperature Flux-Coated Washers for Heat-Sensitive Components
To protect electronic materials prone to thermal degradation or distortion under high-temperature exposure—such as sensors, LEDs, and batteries—YUJIN PREFORM highlighted its low-temperature solder flux-coated washers fabricated from bismuth-based alloys that melt at 138°C.

This component features an integrated layer of flux controlled to exact volumetric proportions directly on the washer surface, eliminating the need for separate flux deposition steps. This layout enables an integrated assembly sequence that combines mechanical fastening with thermal application. By preventing both insufficient and excessive solder distribution, the washers maintain uniformity across the joining interface. Because the alloy automatically liquefies and joins upon reaching its specified melting point, it functions as a mechanism for stabilizing machine uptime in manual-intensive or temperature-restricted sectors, including automotive electronics and aerospace manufacturing. To complement joint reliability, YUJIN PREFORM has also strengthened its deburring processes to remove micro-burrs formed during production.

Since its establishment in 2005, YUJIN PREFORM has expanded its material expertise, focusing on structural transparency in pricing and delivery flexibility for the Southeast Asian automotive value chain and electronics supply networks at this Thailand exhibition. As manufacturing hubs continue to diversify across the region, the company provides actionable yield-stabilization benchmarks for ASEAN enterprises seeking high-quality precision component fabrication.

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